The ISSE (International Spring Seminar on Electronics Technology) is one of the largest conferences encompassing all topics around the electronics technology all over the world and will be attended by 120 - 140 experts and young researchers from more than 13 countries. The main focus of the ISSE is both directed in bringing deeper knowledge and information of electronics technology, and, especially for young researchers, to increase or confirm a motivation for intensifying their engagement in the field of electrical engineering. The conference is an effective crucial point for institutions, government officials, pioneering engineers, academics, experienced and young researchers and many other professionals working on relevant fields to discuss the current challenges and to provide up-to-date knowledge.

The ISSE 2019 will continue a long tradition of the preceding ISSE conference, starting by 1977 (Weissig/Germany) and the last one held in Zlatibor (Serbia, 2018).

The ISSE 2019 will be hosted by the Wroclaw University of Science and Technology, Faculty of Microsystem Electronics and Photonics. Wroclaw is the capital city of Lower Silesia located in south-western Poland on the Oder River. The choice for Wroclaw was made by the international steering committee members that are worldwide leading scientists in the electronics technology field.

The hosting of such a famous international conference is not only a great chance to demonstrate the high level scientific research at the Wroclaw University of Science and Technology as well as to present the latest developed products but also a good opportunity to present the town Wroclaw as a beautiful city with a long tradition in history and culture. Reaching these aims presuppose both, the hard work of the scientific and organizing committee for preparing the conference, and above all a great support by local and governmental authorities as well as the leading companies in relevant fields.

1. New Materials, Components and Processes
2. Thermal Management
3. Advanced Packaging and Interconnection Technologies
4. Testing, Reliability and Quality Management
5. Process Modelling and Simulation
6. Environmental and Ecological Effects in Electronics Technology
7. Nanotechnology, Nanomaterials and Nanoelectronics
8. Signal Integrity and Electromagnetic Compatibility
9. Sensors, Actuators and Microsystems
10. Educational and Information Technologies in Electronics Manufacturing
11. Discrete and Integrated Components

General Chairman of ISSE
Heinz Wohlrabe (Dresden University of Technology, Germany)

Secretary of ISSE
Oliver Krammer (Budapest University of Technology and Economics, Hungary)

Conference Chairman
Priotr Markowski (Wrocław University of Science and Technology, Poland)

Technical Program Committee (TPC) – Chairman of TPC
Johann Nicolics (Vienna University of Technology, Austria)

Local Organizing Committee (Wrocław University of Science and Technology, Poland)
Conference Chair: Piotr Markowski
Board of Organizers: Karol Malecha, Arkadiusz Dąbrowski, Damian Nowak, Olga Rac-Rumijowska, Mateusz Czok, Mirosław Gierczak, Laura Jasińska, Milena Kiliszkiewicz, Witold Nawrot, Dariusz Przybylski, Krzysztof Stojek, Marta Turkiewicz

International Steering Committee
Anna Stoynova Andonova – Technical University of Sofia, Bulgaria
Chris Bailey – Greenwich University, London, United Kingdom
Reinhard Bauer – University of Applied Sciences, Dresden, Germany
Nelu Blaz – University of Novi Sad, Serbia
Tomáš Blecha – University of West Bohemia in Pilsen, Czech Republic
Detlef Bonfert – Fraunhofer Research Intsitution EMFT, Munich, Germany
Radu Bozomitu – "Gheorghe Asachi" Technical University of Iasi, Romania
Mihai Branzei – University Politehnica of Bucharest, Romania
Martin Bursik – Brno University of Technology, Czech Republic
Vlad Cehan – "Gheorghe Asachi" Technical University of Iasi, Romania
Emilian Ceuca – “1 Decembrie 1918” University, Alba Iulia, Romania
Norocel Codreanu – University Politehnica of Bucharest, Romania
Karel Dušek – Czech Technical University Prague, Czech Republic
Andrzej Dziedzic – Wrocław University of Science and Technology, Poland
Jan Felba – Wrocław University of Science and Technology, Poland
Leszek Golonka – Wrocław University of Science and Technology, Poland
Karol Malecha – Wrocław University of Science and Technology, Poland
Piotr Markowski – Wrocław University of Science and Technology, Poland
Marko Hrovat – Jožef Stefan Institute, Ljubljana, Slovenia
Balazs Illes – Budapest University of Technology and Economics, Hungary
Zsolt Illyefalvi-Vitéz – Budapest University of Technology and Economics, Hungary
Ciprian Ionescu – University Politehnica of Bucharest, Romania
Malgorzata Jakubowska – Institute of Electronic Materials Technology, Warsaw, Poland
Ryszard Kisiel – Warsaw University of Technology, Poland
Ioan Liţă – University of Pitesti, Romania
Pavel Mach – Czech Technical University Prague, Czech Republic
Petko Hristov Mashkov – University of Ruse, Bulgaria
James E. Morris – Portland State University, OR, USA
Nencho Nenov – University of Transport, Sofia, Bulgaria
Johann Nicolics – Vienna University of Technology, Austria
Tamara Pencheva – University of Ruse, Bulgaria
Alena Pietriková – Technical University of Košice, Slovakia
Philipp Philippov – Technical University of Sofia, Bulgaria
Dan Pitică – Technical University of Cluj-Napoca, Romania
Goran Radosavljevic – Vienna University of Technology, Austria
Stoyan Stoyanov – Greenwich University, London, United Kingdom
Paul Svasta – University Politehnica of Bucharest, Romania
Ivan Szendiuch – Brno University of Technology, Czech Republic
Borys Tsyganok – National Technical University of Ukraine "Igor Sikorsky Kyiv Polytechnic Institute", Kiev, Ukraine
Klaus-Jürgen Wolter – Dresden University of Technology, Germany
Ljiljana Zivanov – University of Novi Sad, Serbia
Frantisek Steiner – University of West Bohemia in Pilsen, Czech Republic
David Bušek – Czech Technical University Prague

ISSE is a series of annual conferences and a network of electronics packaging education - was founded in 1977 to provide European forum for the exchange of information between senior and junior scientists from academic communities and electronic industries from around the world on topics related to their experimental and theoretical work in the very wide-spread field of electronics and microelectronics technology and packaging.

Order, Year, Theme, Venue: 
1st 1977 Application of Mathematics in Electronics Technology, Weissig, Germany 
2nd 1978 Reliability in Electronics, Prenet, Czechoslovakia 
3rd 1979 Measurements in Electronics Technology, Balatonfüred, Hungary 
4th 1980 Hybrid Technology, Manebach, Germany 
5th 1982 Physical Measuring Methods, Prenet, Czechoslovakia 
6th 1983 Research and Education in Microelectronics, Balatonfüred, Hungary 
7th 1984 Applications of Microprocessors in Technology, Geising, Germany 
8th 1985 Power Semiconductors, Hybrid Devices, Prenet, Czechoslovakia 
9th 1986 Progress in Physical Measuring Methods on Electronics Technology, Balatonfüred, Hungary 
10th 1987 Progress in Education in Hybrid Microelectronics, Sozopol, Bulgaria 
11th 1988 Progress in Surface Mount Technology, Karsdorf, Germany 
12th 1989 Thermal Problems in Electronics Technology, Prenet, Czechoslovakia 
13th 1990 Computer Aided Electronics Technology, Göd, Hungary 
14th 1991 Total Quality Control in Hybrid Production, Sozopol, Bulgaria 
15th 1992 Higher Education in Electronic Technology, Herlany, Slovak Republic 
16th 1993 Thick and Thin Film Sensors, Szklarska Poreba, Poland 
17th 1994 Process Technology of Electronics, Weissig, Germany 
18th 1995 Advanced Electronics Technology, Temesvár, Czech Republic 
19th 1996 Advanced Electronics Technology, Göd, Hungary 
20th 1997 Education and Research in Microelectronics, Szklarska Poreba, Poland 
21st 1998 Advanced Electronics Technology, Neusiedl am See, Austria 
22nd 1999 Driving Forces in Electronics Technology, Freital, Germany 
23rd 2000 Networking Electronics Packaging Education, Balatonfüred, Hungary 
24th 2001 Concurrent Engineering in Electronic Packaging, Calimanesti-Caciulata, Romania 
25th 2002 Quality Management and Diagnostics in Electronics Packaging, Prague, Czech Republic 
26th 2003 Integrated Management of Electronic Materials Production, High Tatras, Slovak Republic 
27th 2004 Meeting the Challenges of Electronics Technology Progress, Bankia / Sofia, Bulgaria 
28th 2005 European Electronic Packaging Network, Wiener Neustadt, Austria 
29th 2006 Nano-Technologies for Electronics Packaging, St. Marienthal/Dresden, Germany 
30th 2007 Emerging Technologies for Electronics Packaging, Cluj-Napoca, Romania 
31st 2008 Reliability and Life-time Prediction, Budapest, Hungary 
32nd 2009 Technology Integration, the path to New Solutions in the Modern Electronics, Brno, 
Czech Republic 
33rd 2010 Polymer Electronics and Nanotechnologies: Towards System Integration, Warsaw, Poland 
34th 2011 New Trends in Micro/Nanotechnology, Tatranská Lomnica, Slovak Republic 
35th 2012 Power Electronics, Bad Aussee, Austria 
36th 2013 Automotive Electronics, Alba Iulia, Romania 
37th 2014 Advances in Electronic System Integration, Dresden, Germany 
38th 2015 Novel Trends in Electronics Manufacturing, Eger, Hungary 
39th 2016 Printed electronics and smart textiles, Pilsen, Czech Republic
40th 2017 High-Tech Electronics for a Better Tomorrow - Theoretical and Practical Aspects, Sofia, Bulgaria
41st 2018 Research and Development Tendencies in Advanced Electronics Technologies, Zlatibor, Serbia